Elektronische Bauelemente werden in zahlreichen Gehäuse- und Montageformen angeboten. Ihre Abkürzungen beschreiben häufig Material, Anschlussanordnung, Raster, Bauhöhe oder Montagetechnik. Die folgende Übersicht hilft dabei, Angaben in Datenblättern, Stücklisten und technischen Dokumentationen einzuordnen.
Hinweis zur Verwendung
Ein Kürzel kann je nach Fachgebiet mehrere Bedeutungen haben. Für die Auswahl eines Bauteils sind deshalb immer das konkrete Datenblatt, die Abmessungen und die Anschlussbelegung maßgeblich.
A–C
- BCA
- Bare Chip Attach
- BCP
- Bare Chip Processing
- BCC
- Bump Chip Carrier
- BEM
- Boundary Element Method
- BGA
- Ball Grid Array
- BQFP
- Bumpered Quad Flat Pack
- BTAB
- Bumped Tape Automated Bonding
- C&P
- Collect and Place
- C&W
- Chip and Wire
- C4
- Controlled Collapse Chip Connection
- C5
- Controlled Collapse Chip Connection on Ceramic
- CBGA
- Ceramic Ball Grid Array
- CCGA
- Ceramic Column Grid Array
- CDIP
- Ceramic Dual Inline Package
- CERDIP
- Ceramic Dual Inline Package
- CERPACK
- Ceramic Package
- CLCC
- Ceramic Leaded Chip Carrier
- CLLCC
- Ceramic Lead-Less Chip Carrier
- CLGA
- Ceramic Land Grid Array
- CoB
- Chip on Board
- CoC
- Chip on Chip
- CoF
- Chip on Flex
- CoG
- Chip on Glass
- COL
- Chip on Lead
- CPGA
- Ceramic Pin Grid Array
- CQFP
- Ceramic Quad Flat Package
- CSMP
- Chip-Sized MEMS Package
- CSP
- Chip Scale Package
- CSSP
- Chip-Sized SAW Package
- CZIP
- Ceramic Zig-Zag Package
D–F
- DBGA
- Dimpled Grid Array
- DCA
- Direct Chip Attach
- DFN
- Dual Flat No-Lead
- DFP
- Dual Flat Package
- DIMM
- Dual Inline Memory Module
- DIP
- Dual Inline Package
- DLA
- Direct Lid Attach
- DLCC
- Dual Lead-Less Chip Carrier
- DPAK
- Discrete Package
- DRMLF
- Dual Row Micro Leadframe
- DSSP
- Die-Sized SAW Package
- EBGA
- Enhanced Ball Grid Array
- ETQFP
- Exposed Thin Quad Flat Package
- FBGA
- Fine-Pitch Ball Grid Array
- FCBGA
- Flip Chip Ball Grid Array
- FC-LGA
- Flip Chip Land Grid Array
- FC-PGA
- Flip Chip Pin Grid Array
- FC-QFN
- Flip Chip Quad Flat No-Lead
- FLGA
- Fine Land Grid Array
- FCIP
- Flip Chip in Package
- FCOS
- Flip Chip on Substrate
- FP
- Flat Package
- FQFP
- Fine-Pitch Quad Flat Package
H–L
- HDA
- High Density Array
- HDI
- High Density Interconnect
- HLQFP
- Thermally Enhanced Low Profile QFP
- HQFP
- Thermally Enhanced Quad Flat Package
- HSOP
- Thermally Enhanced Small-Outline Package
- HSSOP
- Thermally Enhanced Shrink Small-Outline Package
- HTCC
- High Temperature Cofired Ceramic
- HTQFP
- Thermally Enhanced Thin Quad Flat Package
- HTSSOP
- Thermally Enhanced Thin Shrink Small-Outline Package
- IPAK
- Integrated Package
- JLCC
- J-Leaded Ceramic or Metal Chip Carrier
- LBGA
- Low Profile Ball Grid Array
- LCC
- Leadless Chip Carrier
- LCCC
- Leadless Ceramic Chip Carrier
- LFBGA
- Low Profile Fine-Pitch Ball Grid Array
- LFCSP
- Leadframe Chip Scale Package
- LGA
- Land Grid Array
- LIF
- Low Insertion Force
- LLP
- Leadless Leadframe Package
- LPCC
- Leadless Plastic Chip Carrier
- LQFP
- Low Profile Quad Flat Package
- LTCC
- Low Temperature Cofired Ceramic
M–P
- MCM
- Multi-Chip Module
- MCP
- Multi-Chip Package
- MDIP
- Molded Dual Inline Package
- MELF
- Metal Electrode Leadless Face
- MID
- Molded Interconnect Device
- MLF
- Micro Lead Frame
- MLP
- Micro Leadframe Package
- MLPD
- Micro Leadframe Package Dual
- MLPQ
- Micro Leadframe Package Quad
- MQFP
- Metal Quad Flat Package
- MSOP
- Micro Small-Outline Package
- OBGA
- Organic Ball Grid Array
- ODFN
- Optical Dual Flat No-Lead Plastic
- OPGA
- Organic Pin Grid Array
- PBGA
- Plastic Ball Grid Array
- PGA
- Pin Grid Array
- PDIP
- Plastic Dual-Inline Package
- PFBGA
- Plastic Fine-Pitch Ball Grid Array
- PLCC
- Plastic Leaded Chip Carrier
- PoP
- Package on Package
- PPGA
- Plastic Pin Grid Array
- PQFN
- Power Quad Flat No-Lead
- PQFP
- Plastic Quad Flat Package
- PSOP
- Power Small Outline Package
Q–S
- QFJ
- Quad Flat J-Lead
- QFN
- Quad Flat No-Lead
- QFP
- Quad Flat Package
- QUIL
- Quad In-Line
- QSOP
- Quarter Size Outline Package
- SBGA
- Super Ball Grid Array
- SDIP
- Shrink Dual-Inline Package
- SECC
- Single Edge Contact Cartridge
- SESUB
- Semiconductor Embedded in Substrate
- SHP
- Surface Horizontal Package
- SIMM
- Single Inline Memory Module
- SIP
- Single-Inline Package
- SiP
- System in Package
- SIPP
- Single Inline Pinned Package
- SMD
- Surface Mounted Device
- SoC
- System on Chip
- SOD
- Small Outline Diode Package
- SODIMM
- Small Outline Dual-Inline Memory Module
- SOIC
- Small Outline Integrated Circuit
- SOJ
- J-Leaded Small-Outline Package
- SOP
- Small-Outline Package
- SOT
- Small Outline Transistor
- SPGA
- Staggered Pin Grid Array
- SQFP
- Shrink Quad Flat Package
- SSOP
- Shrink Small-Outline Package
T–Z
- TBGA
- Thin Ball Grid Array
- TCP
- Tape Carrier Package
- TCSP
- True Chip Size Package
- TDFN
- Thin Dual Flat No-Lead
- TDSP
- True Die Size Package
- TFBGA
- Thin Fine-Pitch Ball Grid Array
- TO
- Transistor Outline
- TQFN
- Thin Quad Flat No-Lead
- TQFP
- Thin Quad Flat Package
- TSLP
- Thin Small Leadless Package
- TSOP
- Thin Small-Outline Package
- TSSLP
- Thin Super Small Leadless Package
- TSSOP
- Thin Shrink Small-Outline Package
- TVSOP
- Very Thin Small-Outline Package
- UCSP
- Ultra Chip Scale Package
- UFBGA
- Ultra Fine Ball Grid Array
- UTDFN
- Ultra Thin Dual Flat No-Lead
- VFBGA
- Very-Thin Fine-Pitch Ball Grid Array
- VQFP
- Very Thin Quad Flat Package
- VSOP
- Very Small Outline Package
- WCSP
- Wafer Chip Scale Package
- WLCSP
- Wafer-Level Chip Scale Package
- WLP
- Wafer Level Package
- WSON
- Very Very Thin Small Outline No-Lead Package
- XDFN
- Extreme Thin Dual Flat No-Lead
- ZIF
- Zero Insertion Force
- ZIP
- Zig-Zag In-Line Package
- µPGA
- Micro Pin Grid Array
Abgrenzung: Manche Einträge bezeichnen nicht ausschließlich ein Gehäuse, sondern auch eine Montage-, Integrations- oder Verbindungstechnik. Die Übersicht bewahrt diese in technischen Unterlagen gebräuchliche Zuordnung.